DUBLIN, February 6, 2014 /PRNewswire/ —

Research and Markets (http://www.researchandmarkets.com/research/fpj6dd/silicon_labs) has announced the addition of the „Silicon Labs Si504 – CMEMS Oscillator Reverse Costing Analysis” report to their offering.

     (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )

First Fully Integrated, Monolithic Cmos+Mems Oscillator Device

The frequency control market is largely dominated by quartz products, but silicon timing solutions have a strong value proposition for some sub-markets.

The Si504 is the first silicon oscillator from Silicon Labs. Manufactured with the CMEMS process (CMOS + MEMS), the crystal elements are replaced by micromachined semiconductor resonators.

CMEMS process consists in a monolithic integration of a CMOS circuit with Poly-SiGe (polycrystalline silicon-germanium) MEMS resonator structures.

The resonator is then vacuum encapsulated with a silicon cap using an eutectic wafer bonding process.

The Si504 is optimized to support high-volume, low-cost applications such as consumer electronics market.

This report will provide a complete teardown of the MEMS oscillator with:

• Detailed photos
• Material analysis
• Schematic assembly description
• Manufacturing Process Flow
• In-depth manufacturing cost analysis
• Supply chain evaluation
• Selling price estimation

Key Topics Covered:

Glossary

Overview/Introduction

• Executive Summary
• Reverse Costing Methodology

Silicon Labs Company Profile

• Silicon Labs Profile
• Si504 Characteristics

Physical Analysis

• Silicon Labs Si504
• CMEMS Oscillator
• Physical Analysis Methodology
• Package
• Package View, Dimensions & Pinout
• Package XRay
• Package Opening
• Package CrossSection
• Die
• View, Dimensions & Marking
• MEMS Cap Removed
• MEMS Cap Details
• MEMS Resonator Structure
• CMEMS Delayering & IC Process
• MEMS Cap CrossSection
• CMEMS CrossSection
• IC Layers
• MEMS Layers

Manufacturing Process Flow

• Global Overview
• CMOS FrontEnd Process
• MEMS Resonator Process Flow
• MEMS Cap & Assembly Process Flow
• Wafer Fabrication Unit
• Packaging Process Flow & Assembly Unit

Cost Analysis

• Main steps of economic analysis
• Yields Hypotheses
• CMOS FrontEnd Cost
• MEMS Resonator FrontEnd Cost
• MEMS Cap FrontEnd Cost
• CMEMS/Cap Assembly Cost
• MEMS FrontEnd Cost per process steps
• MEMS FrontEnd: Equipment Cost per Family
• MEMS FrontEnd: Material Cost per Family
• Total Frontend Cost & Price
• BackEnd 0 : Probe Test & Dicing
• Wafer & Die Cost
• BackEnd : Packaging & Final Test Cost
• Si504 Component Cost

Estimated Price Analysis

• Silicon Labs Financial Ratios
• Si504 Estimated Price

For more information visit http://www.researchandmarkets.com/research/fpj6dd/silicon_labs

Media Contact: Laura Wood , +353-1-481-1716, [email protected]