DUBLIN, February 6, 2014 /PRNewswire/ —

Research and Markets (http://www.researchandmarkets.com/research/9l2njj/bosch_sensortec) has announced the addition of the „Bosch Sensortec BMX055 9-Axis MEMS IMU – Reverse Costing Analysis” report to their offering.

     (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )

The first 9-Axis MEMS IMU from Bosch for Consumer Applications
Combines 3-Axis Gyroscope, 3-Axis Accelerometer and 3-Axis Magnetometer

In the race of motion integration, Bosch Sensortec has released its first 9-Axis IMU for consumer applications. The BMX055 combines a 12-bit 3-Axis accelerometer, a 16bit 3-Axis gyroscope and a wide-range 3-Axis geomagnetic sensor in a 4.5×3.0mm LGA package (the smallest footprint at its introduction).

It is the first 9-Axis MEMS IMU where all the functionalities are developed and manufactured by the same player. The BMX055 integrates the second generation of Bosch geomagnetic sensor where the 3-Axis are integrated on a single die compared to 3 separates dies for the previous generation.

This report provides a complete teardown of the MEMS IMU with:

• Detailed photos
• Material analysis
• Schematic assembly description
• Manufacturing Process Flow
• In-depth manufacturing cost analysis
• Selling price estimation

Key Topics Covered:

Introduction, Bosch Company Profile

Physical Analysis

• Package
• Package Views, Dimensions & Pin Out
• Package Opening
• Wire bonding process
• Package CrossSection
• ASIC Gyro & Accelero Dies
• View, Dimensions & Marking
• Delayering
• Main Blocks Identification
• CrossSection
• MEMS Gyro & Accelero Dies
• View, Dimensions & Marking
• Bond Pad Opening & Bond Pad
• Cap Removed & Cap Details
• Sensing Area Details
• CrossSection (Sensor, Cap & Bonding)
• Process Characteristics
• Magnetometer Die
• View, Dimensions & Marking
• Hall sensor and fluxgate sensors
• Delayering
• Main Blocks Identification
• CrossSection (CMOS & Sensor)

Manufacturing Process Flow

• ASIC Gyro & Accelero FrontEnd Process
• MEMS Gyro & Accelero Process Flow
• Magnetometer Process Flow
• Wafer Fabrication Unit
• Packaging Process Flow
• Package Assembly Unit

Cost Analysis

• Main steps of economic analysis
• Yields Hypotheses
• ASIC Gyro & Accelero FrontEnd Cost
• ASIC Gyro & Accelero BackEnd 0 : Probe Test & Dicing
• ASIC Gyro & Accelero Wafer & Die Cost
• MEMS Gyro & Accelero FrontEnd Cost
• MEMS Gyro & Accelero BackEnd 0 : Probe Test & Dicing
• MEMS Gyro & Accelero Wafer & Die Cost
• Magnetometer CMOS FrontEnd Cost
• Magnetometer Sensor Cost
• Magnetometer BackEnd 0 : Probe Test & Dicing
• Magnetometer Wafer & Die Cost
• BackEnd : Packaging Cost
• BackEnd : Final Test & Calibration Cost
• BMX055 Component Cost

Estimated Price Analysis

For more information visit http://www.researchandmarkets.com/research/9l2njj/bosch_sensortec

Media Contact: Laura Wood , +353-1-481-1716, [email protected]